Is there any special reason to use the DIP package (instead of the SMD counterpart) for the AQH1213 solid state relay?
All the taller components are on the top side of the board and are through hole. If AQH is changed to SMT then it will need to be moved to the other side of the board to keep all SMT on the same side. This will require additional clearance from the bottom of the board to the mounting surface.
ok. Thank you for the prompt answer. I was wondering if there were safety and/or maintenance concerns behind this decision.